Semiconductor Engineering's Inside Chips
Everything starts with AI — stacked die and chiplets, digital twins, and looming job market changes.
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9 episoder
One-on-One With proteanTecs CEO Shai Cohen
The acceleration of technology s unprecedented: AI data centers, edge build-out, robotics, photonics, quantum, multi-die assemblies. Semiconductor Engineering Editor in Chief Ed Sperling talks with proteanTecs CEO Shai Cohen about what's changing and what impact it will have.
Big Changes Ahead For Semiconductor Manufacturing
John Kibarian, CEO of PDF Solutions, talks with Semiconductor Engineering's Ed Sperling about the growing role of AI in chip manufacturing, the impact of 3D-ICs on the supply chain, and how to shorten cycle time to get leading-edge chips and multi-die assemblies to market more quickly.
One-On-One With Arteris CEO Charlie Janac
AI is everywhere, and it includes a lot of data that needs to be processed, moved, stored, and retrieved. That takes a lot of energy, and it creates a whole bunch of problems that need to be addressed throughout a chip's lifecycle.
The DAC Report, July 2
One-on-one with imec's Jo De Boeck
News and insights from imec ITF World 2025, including a one-on-one interview with imec's chief strategy officer on system technology co-optimization with AI.
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