Embedded Insiders
Send us Fan Mail [https://www.buzzsprout.com/280493/fan_mail/new] On this episode of Embedded Insiders, Aravind Srikumar, SVP of Product & Marketing at Upscale AI, joins the podcast to discuss how the company is tackling both scale-up and scale-out networking, why it's important to address both sides of the networking equation, and today's requirements for an AI-optimized network [ps://upscaleai.com/ai-infrastructure-from-general-to-purpose-built/]. (Upscale AI's recent announcement with NVIDIA: https://upscaleai.com/upscale-ai-supercharges-open-heterogeneous-scale-out-ai-clusters-with-nvidia-ethernet-switch-silicon/ [https://upscaleai.com/upscale-ai-supercharges-open-heterogeneous-scale-out-ai-clusters-with-nvidia-ethernet-switch-silicon/]) Next, Rich is joined by David Sandys, the Senior Director of Technical Enablement and Engagement at DigiKey [https://www.digikey.com/], with a recap of embedded world. But first, Ken and I are talking about the advanced packaging trend, and how it seems the industry is shifting from the traditional chip scaling approach that is Moore's Law. For more information, visit embeddedcomputing.com [https://embeddedcomputing.com/]
304 afleveringen
Reacties
0Wees de eerste die een reactie plaatst
Meld je nu aan en word lid van de Embedded Insiders community!