PCB Chat

RM 193: Why Post-Reflow Cleaning Is Becoming Mainstream Again

13 min · 29 mei 2026
aflevering RM 193: Why Post-Reflow Cleaning Is Becoming Mainstream Again artwork

Beschrijving

For decades, cleaning circuit assemblies after soldering was not optional. It was standard practice across the electronics manufacturing industry. Then, almost overnight, that changed. In this episode of Reliability Matters, Mike Konrad takes you back to the origins of that shift. From the widespread use of CFC-based cleaning solvents to the global impact of the Montreal Protocol, this episode explains how environmental regulation led to the rapid adoption of no-clean flux and the removal of cleaning as a standard process step. But that decision came with assumptions. Assumptions based on larger components, wider spacing, and assemblies that were far more tolerant of residues than what we see today. As electronics evolved, so did the risk. Miniaturization, increased component density, and the expansion of electronics into harsh environments have dramatically reduced the tolerance for contamination. And when cleaning was removed, it wasn’t just flux that remained. It was the totality of residues introduced throughout the manufacturing process. This episode walks through how those residues, combined with moisture and electrical bias, can lead to electrochemical migration, including parasitic leakage and dendritic growth, often resulting in delayed or intermittent failures. This is the story of how we got here. In Part 2, we bring this discussion into the present. What does “clean” actually mean today? Why did the industry move away from fixed cleanliness limits? And why is cleaning once again becoming a critical part of modern electronics manufacturing? If you’ve ever asked the question, “Do I really need to clean?” Part 2 will challenge how you think about the answer.

Reacties

0

Wees de eerste die een reactie plaatst

Meld je nu aan en word lid van de PCB Chat community!

Probeer gratis

Probeer 14 dagen gratis

€ 9,99 / maand na proefperiode. · Elk moment opzegbaar.

  • Podcasts die je alleen op Podimo hoort
  • 20 uur luisterboeken / maand
  • Gratis podcasts

Alle afleveringen

360 afleveringen

aflevering RM 193: Why Post-Reflow Cleaning Is Becoming Mainstream Again artwork

RM 193: Why Post-Reflow Cleaning Is Becoming Mainstream Again

For decades, cleaning circuit assemblies after soldering was not optional. It was standard practice across the electronics manufacturing industry. Then, almost overnight, that changed. In this episode of Reliability Matters, Mike Konrad takes you back to the origins of that shift. From the widespread use of CFC-based cleaning solvents to the global impact of the Montreal Protocol, this episode explains how environmental regulation led to the rapid adoption of no-clean flux and the removal of cleaning as a standard process step. But that decision came with assumptions. Assumptions based on larger components, wider spacing, and assemblies that were far more tolerant of residues than what we see today. As electronics evolved, so did the risk. Miniaturization, increased component density, and the expansion of electronics into harsh environments have dramatically reduced the tolerance for contamination. And when cleaning was removed, it wasn’t just flux that remained. It was the totality of residues introduced throughout the manufacturing process. This episode walks through how those residues, combined with moisture and electrical bias, can lead to electrochemical migration, including parasitic leakage and dendritic growth, often resulting in delayed or intermittent failures. This is the story of how we got here. In Part 2, we bring this discussion into the present. What does “clean” actually mean today? Why did the industry move away from fixed cleanliness limits? And why is cleaning once again becoming a critical part of modern electronics manufacturing? If you’ve ever asked the question, “Do I really need to clean?” Part 2 will challenge how you think about the answer.

29 mei 202613 min
aflevering RM 191: Why Maintenance Is Finally Getting a Seat at the Table artwork

RM 191: Why Maintenance Is Finally Getting a Seat at the Table

Today’s episode is going to resonate with anyone responsible for uptime, efficiency, and ultimately, product reliability.  Because whether we’re talking about circuit assemblies, manufacturing lines, or entire facilities, reliability doesn’t start at inspection. It starts with maintenance. Mike Konradf's guest is Paul Ross, chief marketing officer at Limble, a company providing modern maintenance and asset management solutions to thousands of organizations worldwide. With more than 25 years of experience in enterprise and high-growth software companies, Ross has spent his career helping organizations leverage data, systems, and strategy to improve performance. Today, we’re going to explore how maintenance has evolved from a reactive necessity to a strategic driver of reliability, what companies are still getting wrong, and how modern tools are changing the game.

28 mei 202613 min