LightMinds
Photonic Integrated Circuits are powering the next wave of AI and data‑center innovation, but packaging and standards are becoming major challenges to scale. In this episode, we sit down with Peter O’Brien, Richard Pitwon, and Kazu Takano to break down the real‑world obstacles behind PIC adoption. From packaging and manufacturability to standards, serviceability, and system integration, the conversation connects research, industry, and deployment realities. A clear and engaging discussion on why PICs are hard, what’s holding them back, and what needs to change next.
4 Folgen
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