S04 E13 - Travis Hilton - Getting Proper Ratios on Tin/Lead Deposits
In this episode of Seen and Solved, Travis Hilton, Operations Manager at Hubbard-Hall, discusses one of the most critical controls in electronics and specialty metal finishing: achieving and maintaining the proper tin-lead plating ratio.
Tin-lead electroplating is still widely used in aerospace, medical, military, and electronics applications where solderability, ductility, and corrosion resistance are required. Maintaining consistent alloy ratios—such as 60/40 or 90/10 tin-lead—depends on tight control of bath chemistry, current density, temperature, agitation, and preventative maintenance.
This episode covers:- How modern methane sulfonic acid (MSA) tin-leadplating baths are formulated- How tin and lead concentrations are measuredusing titration and atomic absorption (AA)- Why deposit ratios can shift even when solutionchemistry is in control- How current density influences alloy compositionand coating performance- The effect of tin-rich vs. lead-rich deposits onsolderability, ductility, and brittleness- Common issues such as stannic tin formation,organic contamination, and bath instability- Filtration, anode maintenance, and processcontrols to extend bath life- Waste treatment and disposal considerations forlead-bearing plating chemistries
For plating engineers, process managers, and quality teams working with tin-lead electroplating for electronic components, connectors, and wire bonding, this discussion explains how chemistry control and operating discipline directly impact deposit ratio, reliability, and long-term performance.